The present invention relates to a multilayer thin film insulator with the grounding through a conductive film. More specifically, the present invention relates to a multilayer thin film insulator with the grounding through a conductive film, which is able to omit a ground rivet and a ground wire installed for each thin film thanks to the conductive film. There is no need for a ground hole, which greatly reduces the work-hours for grounding. To this end, according to the present invention, the multilayer thin film insulator with the grounding through a conductive film comprises: a multilayer insulation module in which a plurality of thin films are stacked and mounted on a conductive structure, and including one or more conductive thin films with one or more of the upper surface and lower surface having a conductive layer; one or more conductive films having one side come in contact with the conductive layer, and having the other side attached to the conductive structure; and a fixing means for fixing the contact surface between the conductive thin film and the conductive film.

    본 발명은 전도필름을 통해 접지가 이루어지는 다층 박막 단열재에 관한 것으로 더욱 상세하게는 전도필름을 통해 기존 각 박막필름별 설치되는 그라운드 리벳과 그라운드 전선을 생략할 수 있어 그라운드 홀이 필요 없고 접지를 위한 공수를 대폭 감소시킬 수 있는 전도필름을 통해 접지가 이루어지는 다층 박막 단열재에 관한 것이다. 이를 위해 본 발명은 복수의 박막필름이 적층되어 전도성 구조체에 장착되며, 상, 하면 중 적어도 일면에 전도층이 형성된 전도박막필름이 적어도 하나 포함되는 다층단열모듈; 상기 전도층과 일측이 서로 접하는 접면을 형성하고, 타측은 전도성 구조체에 부착되는 적어도 하나의 전도필름; 및 상기 전도박막필름과 전도필름 간의 접면을 고정하기 위한 고정수단;을 포함한다.


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    Titel :

    Multi-layer thin-film insulation with grounding through conductive film


    Weitere Titelangaben:

    전도필름을 통해 접지가 이루어지는 다층 박막 단열재


    Beteiligte:
    LEE JANG JOON (Autor:in) / KIM JUNG HOON (Autor:in) / HYUN BUM SEOK (Autor:in) / JANG BYUNG KWAN (Autor:in) / KIM SU KYUM (Autor:in) / WON SU HEE (Autor:in)

    Erscheinungsdatum :

    2023-06-14


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse



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