The present invention relates to a filling material for a void of a ship, a filling method for the void of the ship, and the ship using the filling method, wherein the filling method can solidly and weightily fill the void generated in case of construction of the ship by using plastic particles and liquid resin, thereby improving stability when the ship sails.

    본 발명은 선박 보이드 충진재, 선박 보이드의 충진 방법 및 이러한 충진 방법이 적용된 선박에 관한 것으로, 선박의 건조시에 생기는 보이드를 플라스틱 입자와 액체 수지를 이용하여 견고하고 중량감있게 충진함으로서 선박 운행시의 안정감을 향상시킬 수 있는 것을 특징으로 한다.


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    Titel :

    Material filling voids of vessel method of filling voids of vessel and vessel applying such filling method


    Weitere Titelangaben:

    선박 보이드 충진재, 선박 보이드의 충진 방법 및 이러한 충진 방법이 적용된 선박


    Beteiligte:
    KANG MIN HO (Autor:in) / JANG JU HYEON (Autor:in) / BAEK EUN HYUN (Autor:in)

    Erscheinungsdatum :

    03.02.2021


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B63B Schiffe oder sonstige Wasserfahrzeuge , SHIPS OR OTHER WATERBORNE VESSELS / C08J Verarbeitung , WORKING-UP



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