Disclosed is an invention relating to a heterogeneous material package tray module. The heterogeneous material package tray module of the present invention comprises: a first bonding material; and a second bonding material laminated on the first bonding material, penetrated by a friction bonding tool so as to be in contact with the first bonding material, and bonding the first bonding material as the friction bonding tool is rotated and moved.

    이종소재 패키지 트레이 모듈에 대한 발명이 개시된다. 본 발명의 이종소재 패키지 트레이 모듈은: 제1 접합소재; 및 제1 접합소재에 적층되고, 제1 접합소재에 접촉되도록 마찰접합툴이 관통되고, 마찰접합툴이 회전되면서 이동됨에 따라 제1 접합소재와 접합되는 제2 접합소재를 포함하는 것을 특징으로 한다.


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    Titel :

    DISSIMILAR MATERIAL PACKAGE TRAY MODULE


    Weitere Titelangaben:

    이종소재 패키지 트레이 모듈


    Beteiligte:
    PARK HYUN KYUNG (Autor:in) / JEONG JI WON (Autor:in)

    Erscheinungsdatum :

    2018-12-10


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B23K Löten , SOLDERING OR UNSOLDERING / B62D MOTOR VEHICLES , Motorfahrzeuge



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