A high-density polyethylene vessel according to the present invention is a high-density polyethylene vessel for preventing cracks of high-density polyethylene vessels generated during a bonding process, comprising: a vessel unit formed of high-density polyethylene and provided long in one direction; a driving unit provided at the stern of the vessel unit to provide a driving force for moving the vessel unit; and a prevention unit provided between the vessel unit and the driving unit, and preventing the vessel unit from being damaged in a course of coupling the vessel unit and the driving unit.

    본 발명에 따른 고밀도폴리에틸렌 선박은, 결합과정에서 발생되는 고밀도폴리에틸렌 선박의 균열을 방지하기 위한 고밀도폴리에틸렌 선박으로서, 고밀도폴리에틸렌으로 형성되어 일방향으로 길게 구비되는 선박유닛, 상기 선박유닛의 선미에 구비되어 상기 선박유닛이 이동되는 구동력을 제공하는 구동유닛 및 상기 선박유닛과 상기 구동유닛 사이에 구비되며, 상기 선박유닛과 상기 구동유닛의 결합과정에서 상기 선박유닛이 파손되는 것을 방지하는 방지유닛을 포함하는 고밀도폴리에틸렌 선박을 제공한다.


    Zugriff

    Download


    Exportieren, teilen und zitieren



    Titel :

    HIGH-DENSITY POLYETHYLENE SHIP


    Weitere Titelangaben:

    고밀도폴리에틸렌 선박


    Beteiligte:
    LEE WON MIN (Autor:in)

    Erscheinungsdatum :

    2023-03-07


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B63H Schiffsantrieb oder Steuerung der Schiffe , MARINE PROPULSION OR STEERING / B63B Schiffe oder sonstige Wasserfahrzeuge , SHIPS OR OTHER WATERBORNE VESSELS



    HIGH-DENSITY POLYETHYLENE SHIP ENGINE ROOM

    LEE WON MIN | Europäisches Patentamt | 2023

    Freier Zugriff

    ship having high-density polyethylene watertight bulkhead

    JEONG KYUNG WOO / KU HYOUN MO / LEE SEUNG HO | Europäisches Patentamt | 2021

    Freier Zugriff

    mould for manufacturing polyethylene ship and manufacturing method of polyethylene ship

    JUNG KYUNG WOO / LEE SEUNG HO / HAN JUNG HEE | Europäisches Patentamt | 2023

    Freier Zugriff


    Mechanical Properties of Rice Hull/High Density Polyethylene and Wood/High Density Polyethylene Composites

    Park, C. B. / Sain, M. / Kuboki, T. et al. | SAE Technical Papers | 2007