To provide a circuit board that secures a mounting area for a control element and a power element and improves mounting efficiency.SOLUTION: One side 25 of a circuit board 22 is arranged so as to face one side in the axial direction of a motor, and a power elements FET1 to FET11 and a control element 31 for motor driving are mounted on the other side 23 of the circuit board 22, and the control element 31 is arranged outside the power elements FET1 to FET11 in the radial direction of the motor on the circuit board 22. Further, heat is conducted from one surface side to the other surface side of the circuit board 22 via copper inlays IL1 to IL11 provided on the circuit board 22 for each power element, and the conducted heat is radiated to an external radiator.SELECTED DRAWING: Figure 3

    【課題】制御素子とパワー素子の実装面積を確保し、実装効率を向上させた回路基板を提供する。【解決手段】回路基板22の一方面側25をモータの軸方向の一方側に対向させて配置するとともに、回路基板22の他方面側23にモータ駆動用のパワー素子FET1〜FET11および制御素子31を実装し、回路基板22上におけるモータの径方向において制御素子31がパワー素子FET1〜FET11よりも外側に配置されている。また、パワー素子ごとに回路基板22に設けた銅インレイIL1〜IL11を介して回路基板22の一方面側から他方面側へ熱伝導し、伝導された熱を外部放熱体へ放熱する。【選択図】図3


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    Titel :

    CIRCUIT BOARD


    Weitere Titelangaben:

    回路基板


    Beteiligte:
    HARADA KAZUKI (Autor:in)

    Erscheinungsdatum :

    09.01.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B62D MOTOR VEHICLES , Motorfahrzeuge / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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