To provide an assembly structure for an electronic component storage case, the assembly structure being designed such that, while a structure for fitting a recess and a projection together via a sealing material is followed, deterioration of an appearance in a case where the sealing material is extruded is eliminated as well as a trouble where the quality of the seating material is unclear in a case extrusion does not occur, and the appearance is appropriately improved while the sealing material is filled sufficiently.SOLUTION: In an assembly structure for an electronic component storage case in which a first case member and a second case member are integrated by sticking their peripheral edges such that one is superposed on the other, the first peripheral edge of the first case member and the second peripheral edge of the second case member are fitted together such that a projection is fitted in a recess via a sealing material. In a portion where the first peripheral edge and the second peripheral edge abut on or opposite to each other on the outermost side of the case, a peripheral groove that opens toward the outside of the case is formed. The peripheral groove 13 is formed of an opening such that a space 12 between the first peripheral edge 8A and the second peripheral edge 9A becomes broader toward the outside of the case.SELECTED DRAWING: Figure 1

    【課題】シール材を介して凹凸嵌合させる構造を踏襲しながらも、シール材がはみ出た場合の外観上の悪化も、はみ出ない場合のシール材の良否が不明となる不具合も解消され、十分にシール材が充填されながら外観も好ましいように改善される電気部品収容ケースの組付構造を提供する。【解決手段】第1ケース部材と第2ケース部材とが、互いの周縁部を重ねての貼着により一体化されてなる電気部品収容ケースの組付構造において、第1ケース部材の第1周縁部と第2ケース部材の第2周縁部とがシール材を介して凹凸嵌合され、第1周縁部と第2周縁部とがケース最外側で当接又は向かい合う対向部に、ケース外側に向けて開口する周溝が形成されている。周溝13は、第1周縁部8Aと第2周縁部9Aとの隙間12がケース外側に行くほど広くなる先拡がり状開口部により形成されている。【選択図】図1


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    Titel :

    ASSEMBLY STRUCTURE FOR ELECTRONIC COMPONENT STORAGE CASE


    Weitere Titelangaben:

    電気部品収容ケースの組付構造


    Beteiligte:
    NAKAKITA KOJI (Autor:in) / NISHIOKA KENJI (Autor:in) / KAWANABE MOTOHIRO (Autor:in) / IIMORI YOSUKE (Autor:in) / SUGIMOTO MASAHIKO (Autor:in)

    Erscheinungsdatum :

    09.01.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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