To provide a connector connection port for external connection, which is superior in the boss strength of a boss part.SOLUTION: A connector connection port for external connection of an electronic device comprises a mold arranged by injection molding of a polybutylene terephthalate resin material. The mold has a boss part provided on an outer or inner peripheral face so as to protrude from the face. In the boss part and under the outer or inner peripheral face on which the boss part is provided, there are voids in the polybutylene terephthalate resin material. Supposing that a total cross section of voids located in a height range of 0-0.5 mm from the outer or inner peripheral face in the boss part is S1, a total cross section of voids located in a depth range of 0-0.5 mm from the outer or inner peripheral face on which the boss part is provided is S2, and the total area of S1 and S2 is 100%, the areal percentage of S1 is 5-45%, and the areal percentage of S2 is 55-95%.SELECTED DRAWING: Figure 3

    【課題】ボス部のボス強度に優れる外部接続用コネクタ接続口を提供する。【解決手段】電子機器における外部コネクタを挿入接続するためのコネクタ接続口であって、前記コネクタ接続口は、ポリブチレンテレフタレート樹脂材料を射出成形した成形体からなり、その外周面又は内周面にはボス部が突設しており、ボス部、並びに、ボス部を突設する外周面又は内周面の下方には、ポリブチレンテレフタレート樹脂材料中に空隙が存在しており、ボス部における前記外周面又は内周面から高さ0〜0.5mmの範囲に存在する空隙の断面面積の合計をS1とし、ボス部を突設する前記外周面又は内周面から深さ0〜0.5mmの範囲に存在する空隙の断面面積の合計をS2とし、S1とS2の合計面積を100%としたとき、S1の面積率が5〜45%、S2の面積率が55〜95%であることを特徴とする電子機器の外部接続用コネクタ接続口。【選択図】図3


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    Titel :

    CONNECTOR CONNECTION PORT FOR EXTERNAL CONNECTION OF ELECTRONIC DEVICE


    Weitere Titelangaben:

    電子機器の外部接続用コネクタ接続口


    Beteiligte:
    YOSHIDA SOKI (Autor:in) / YAMANAKA YASUSHI (Autor:in)

    Erscheinungsdatum :

    06.12.2018


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS / C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen



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