PROBLEM TO BE SOLVED: To provide a signal processing circuit unit housing body that can mitigate the stress occurred on the part pulled out of the covered cable and a mold to mold the signal processing circuit unit housing body.SOLUTION: Inside the mold 100 the first mold 20 and the second mold 30 are assembled while the signal processing circuit unit 65 and a part of each covered cable 64a of the harness 64 are positioned. While the first mold 20 and the second mold 30 are in assembled state, four open holes H are formed to communicate the inside and outside of the mold 100 by way of the groove part 23a of the first mold 20, the groove part 33a of the second mold 30, the groove part 80a of the third mold 80, and the groove part 90a of the fourth mold 90. With each covered cable 64a of the harness 64 being fixed on the open holes H the positions are determined and fixed. Four annular protrusions 35 protruding from the mold 100 toward its inside are formed on the circumference of the open holes H by the protrusion 80b of the third mold 80 and the protrusion 90b of the fourth mold 90.SELECTED DRAWING: Figure 3

    【課題】被覆電線における外部に引き出されている部分に発生する応力を緩和させることができる信号処理回路部収容体および信号処理回路部収容体を成形する金型を提供すること。【解決手段】金型100の内部に信号処理回路部65、およびハーネス64の各被覆電線64aの一部分を配置した状態で、第1型20および第2型30がを組み付ける。第1型20と第2型30とを組み付けた状態において、第1型20の溝部23aと、第2型30の溝部33aと、第3型80の溝部80aと、第4型90の溝部90aとにより金型100の内部と外部とを連通する4つの貫通孔Hが形成される。貫通孔Hにハーネス64の各被覆電線64aが嵌合されることで位置決め固定される。第3型80の突部80bと、第4型90の突部90bとにより貫通孔Hの周縁に金型100からその内部に突出する円環状の4つの突出部35が形成される。【選択図】図3


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    Titel :

    SIGNAL PROCESSING CIRCUIT UNIT HOUSING BODY AND MOLD TO MOLD SIGNAL PROCESSING CIRCUIT UNIT HOUSING BODY


    Weitere Titelangaben:

    信号処理回路部収容体および信号処理回路部収容体を成形する金型


    Beteiligte:

    Erscheinungsdatum :

    2018-09-20


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B62D MOTOR VEHICLES , Motorfahrzeuge



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