PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring material capable of easily producing a wiring material capable of being routed to various wiring routes while suppressing occupation of a wiring space; a wiring material; and a wiring structure.SOLUTION: A method for manufacturing a wiring material 10 in which a round portion 21 that is covered with an insulator 12 where an outer periphery of a conductor 11 formed of a braided wire knitted with an elemental wire formed of a conductive metal material is formed of a resin and has a round shape in cross-sectional view and a flat portion 22 having a rectangular shape in cross-sectional view are provided at least a part in the longitudinal direction includes: a conductor formation step of knitting a plurality of elemental wires to be a conductor 11R having a circle shape in cross-sectional view; an insulator covering step of covering the outer periphery of a conductor 11R with the insulator 12 to the wiring material 10 formed of the round portion 21; and a flat portion formation step of pressing a predetermined portion of the wiring material 10 to form a flat portion 22.SELECTED DRAWING: Figure 7
【課題】配索スペースの占有を抑えつつ、様々な配索経路に配索することが可能な配索材を容易に製造することが可能な配索材の製造方法、配索材及び配索構造を提供すること。【解決手段】導電性金属材料からなる素線を編み込んだ編組線からなる導体11の外周が樹脂からなる絶縁体12で覆われ、断面視円形の丸型部21と、断面視矩形状の平型部22とが、それぞれ長手方向における少なくとも一部に設けられた配索材10の製造方法であって、複数の素線を編み込んで断面視円形状の導体11Rとする導体形成工程と、導体11Rの外周を絶縁体12で覆い、丸型部21からなる配索材10とする絶縁体被覆工程と、配索材10の所定部分をプレスすることで、平型部22を形成する平型部形成工程と、を含む。【選択図】図7
METHOD FOR MANUFACTURING WIRING MATERIAL, WIRING MATERIAL, AND WIRING STRUCTURE
配索材の製造方法、配索材及び配索構造
28.06.2018
Patent
Elektronische Ressource
Japanisch
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