PROBLEM TO BE SOLVED: To provide a technology which can reduce a size of a vehicle body while cooling an electronic component which is arranged in an engine room.SOLUTION: A heat radiation structure of an electronic component comprises: an exterior member 34 having a cover part 34b which covers an ECU 32 arranged in an engine room, and contacts with the ECU 32, and an insertion part 34c inserted into a heat radiation space which is defined as a space different from the engine room through an attachment hole which is formed at a wall for partitioning the engine room; a heat pipe 36 having a heat receiving part 36a which is thermally connected to the cover part 34b, and a heat radiation part which is thermally connected to the insertion part 34c, and transmitting heat which is received by the heat receiving part 36 to the heat radiation part; heat radiation fins 38 which are arranged at the insertion part 34c, and promote the radiation of the heat which is received from the heat radiation part toward a heat radiation space; and a protection member 46 which is interposed between the exterior member 34 and the attachment hole, and protects the exterior member 34 from contact with the attachment hole.SELECTED DRAWING: Figure 4

    【課題】エンジンルーム内に配置される電子部品を冷却しつつ、車体の小型化を図ることができる技術を提供する。【解決手段】エンジンルーム内に配置されるECU32を覆うとともにECU32に接触する覆い部34bと、エンジンルームを区画する壁部に形成される取付孔部を通して、エンジンルームとは別空間として区画される放熱用空間に向けて差し込まれる差込部34cと、を有する外装部材34と、覆い部34bに熱的に接続される受熱部36aと、差込部34cに熱的に接続される放熱部と、を有し、受熱部36aが受けた熱を放熱部に伝達するためのヒートパイプ36と、差込部34cに設けられ、放熱部から受けた熱の放熱用空間への放熱を促進するための放熱フィン38と、外装部材34と取付孔部との間に介装され、取付孔部に対する接触から外装部材34を保護するための保護部材46と、を備える。【選択図】図4


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    Titel :

    HEAT RADIATION STRUCTURE OF ELECTRONIC COMPONENT


    Weitere Titelangaben:

    電子部品の放熱構造


    Beteiligte:
    SAWADA MASAAKI (Autor:in) / AOKI KAZUHIRO (Autor:in) / HIRASAWA MASASHI (Autor:in) / SASAKI CHIKA (Autor:in) / IKEDA MASASHI (Autor:in) / SHIBAMURA MOTOMU (Autor:in)

    Erscheinungsdatum :

    2017-01-05


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES



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