A polymerizable resin layer comprises a solid layer at 20°C, ≥50wt% of the which comprises at least one polymerizable vinyl ester prepolymer having at least two carbon-carbon double bonds which can react to form a cured resin, and a curing system for the prepolymer, said prepolymer comprises at least one prepolymer ( ≥10wt% of the prepolymer based on the weight of the polymerizable resin) having the structure R1n-R2-R1’m, R1 and R1’ are the same or different, n and m are each at least one and the same or different, each of R1 and R1’ includes a carbon-carbon unsaturation at a free end and includes epoxy resin residues. R2 is a polyfunctional linker derived from an epoxide and polyfunctional carboxylic acid of structure R-Fnx: where Fn is a carboxylic acid, x is at least 2, and R comprises aliphatic, araliphatic, cycloaliphatic, heterocyclic and/or aromatic groups and wherein R is optionally substituted.
Polymerisable resin film
08.02.2023
Patent
Elektronische Ressource
Englisch
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