Provided are a polyimide film that, when applied as a material for a spacecraft, exhibits excellent resistance to atomic oxygen derived from an oxygen molecule which is an atmospheric residual component and generates a small amount of outgas compound upon heating; and a polyimide used in the polyimide film. A polyimide for a spacecraft, the polyimide containing a diamine-derived structural unit and an aromatic acid dianhydride-derived structural unit, wherein the polyimide contains, as the diamine-derived structural unit, at least a structural unit derived from a silicon-containing diamine represented by the following formula (1) (provided that the silicon-containing diamine has a number average molecular weight of 500 or less), and a proportion of the structural unit derived from the silicon-containing diamine is 5 to 100 mol% relative to the entire diamine-derived structural unit. (In the formula, R1 and R2 are each independently a divalent aliphatic hydrocarbon group having 3 to 20 carbons, R3, R4, R5, and R6 are each independently a monovalent aliphatic hydrocarbon group having 1 to 3 carbons, and m is 1 or 2.)
POLYIMIDE FOR SPACECRAFT, POLYIMIDE FILM FOR SPACECRAFT, AND SPACECRAFT MEMBER INCLUDING SAME
POLYIMID FÜR RAUMFAHRZEUG, POLYIMIDFILM FÜR RAUMFAHRZEUG UND RAUMFAHRZEUGELEMENT DAMIT
POLYIMIDE POUR ENGIN SPATIAL, FILM DE POLYIMIDE POUR ENGIN SPATIAL, ET ÉLÉMENT D'ENGIN SPATIAL LE COMPRENANT
16.10.2024
Patent
Elektronische Ressource
Englisch
POLYIMIDE FOR SPACECRAFT, POLYIMIDE FILM FOR SPACECRAFT, AND SPACECRAFT MEMBER INCLUDING SAME
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