Embodiments of this application disclose an encapsulation structure and an encapsulation method of a power module, applied to the automotive field. The encapsulation structure includes a power module and a liquid cooler. The power module includes a power module body, a metal baseplate, and heat dissipation finned tubes. A front side of the metal baseplate is connected to the power module body, and a back side of the metal baseplate is connected to the heat dissipation finned tubes. The metal baseplate has a protrusion part protruding from the power module body. There are a plurality of grooves on a fluid pipe of the liquid cooler, a cavity exists between two adjacent grooves of the plurality of grooves, and the cavity is configured to communicate the two adjacent grooves. The power module body is lapped on the groove, a back side of the protrusion part is in contact with an edge surface of the groove, and the heat dissipation finned tubes are placed in the groove. A front weld exists on a front side of the protrusion part, and a back weld exists on the back side of the metal baseplate other than the back side of the protrusion part; and the front weld and the back weld form a welded sealing ring.


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    Titel :

    ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD OF POWER MODULE


    Weitere Titelangaben:

    VERKAPSELUNGSSTRUKTUR UND VERKAPSELUNGSVERFAHREN EINES STROMMODULS
    STRUCTURE D'ENCAPSULATION ET PROCÉDÉ D'ENCAPSULATION DE MODULE DE PUISSANCE


    Beteiligte:
    CHEN HUIBIN (Autor:in) / LIU HAIYAN (Autor:in)

    Erscheinungsdatum :

    2024-03-20


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B23K Löten , SOLDERING OR UNSOLDERING / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen



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