A method for attaching a heat-emitting device and a capillary heat pipe to a panel of a spacecraft wall is disclosed including the steps of: a) positioning a capillary heat pipe on a portion of the panel; attaching female attachment bodies to the panel, the female attachment bodies protruding relative to the capillary heat pipe; c) placing a thermally-conductive and self-curing paste over a portion of the capillary heat pipe or over a heat-emitting device; d) placing a heat-emitting device on the thermally-conductive and self-curing paste and on the female attachment bodies, said heat-emitting device bearing against and being in direct contact with the female attachment bodies, and e) attaching the heat-emitting device and said capillary heat pipe to the panel by attaching male attachment members to the female attachment bodies.


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    Titel :

    PROCÉDÉ DE FIXATION D'UN ÉQUIPEMENT DISSIPATIF, MUR DE VÉHICULE SPATIAL ET VÉHICULE SPATIAL


    Weitere Titelangaben:

    METHOD FOR ATTACHING A HEAT-DISSIPATING PIECE OF EQUIPMENT, SPACECRAFT WALL AND SPACECRAFT
    VERFAHREN ZUR BEFESTIGUNG EINES WÄRMEABFÜHRENDEN TEILS EINER AUSRÜSTUNG, RAUMFAHRZEUGWAND UND RAUMFAHRZEUG


    Beteiligte:
    WALKER ANDREW (Autor:in)

    Erscheinungsdatum :

    20.04.2022


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Französisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS




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