It is an object of the invention to assemble an electronic component to an adherend with no part of the electronic component assembly disposed on one face side of the adherend. An electronic component assembly D includes a fixing part 400 fixable to a first face 11a on a Z-direction side of an adherend 10, an electronic component 100, and a housing 300. The housing 300 includes a fixed portion 320 fixed to the fixing part 400 and a housing body 310 to house the electronic component 100. The housing body 310 includes a first portion 311 disposed on a Z'-direction side relative to the fixing part 400. The first portion 311 of the housing body 310 has a dimension in the Z-Z' direction that is equal to, or smaller than, a dimension in the Z-Z' direction of a housing hole 13 opening in the first face 11a of the adherend 10. The first portion 311 of the housing body 310 is configured to be housed in the housing hole 13 of the adherend 10.


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    Titel :

    ELECTRONIC COMPONENT ASSEMBLY, COMBINATION OF ELECTRONIC COMPONENT ASSEMBLY AND ADHEREND, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT


    Weitere Titelangaben:

    ELEKTRONISCHE KOMPONENTENANORDNUNG, KOMBINATION EINER ELEKTRONISCHEN KOMPONENTENANORDNUNG UND EINER KLEBEFLÄCHE SOWIE VERFAHREN ZUR MONTAGE EINER ELEKTRONISCHEN KOMPONENTE
    ENSEMBLE COMPOSANT ÉLECTRONIQUE, COMBINAISON D'UN ENSEMBLE COMPOSANT ÉLECTRONIQUE ET PARTIE ADHÉRÉE, ET PROCÉDÉ DE MONTAGE DE COMPOSANT ÉLECTRONIQUE


    Beteiligte:
    NODA SHUSHIN (Autor:in) / KUSUDA DAISUKE (Autor:in) / ONOYAMA KOTA (Autor:in) / TAKESHITA ATSURO (Autor:in)

    Erscheinungsdatum :

    2021-11-24


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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