The present invention relates to a release system (1, 2, 3, 4, 5), that includes a segmented structural element (10) comprising: a first segment (10a) designed to be coupled to a first structure, a second segment (10b) designed to be coupled to a second structure, and a solder joint (11) joining respective ends of said first (10a) and second (10b) segments, thus holding down the first and second structures with respect to one another; wherein said solder joint (11) is electromagnetically heatable and includes a solder alloy having a predefined melting temperature. The release system (1, 2, 3, 4, 5) is characterized by further including magnetic field generating means (13, PW1, PW2, PW3, PW4, PW5) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint (11) such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first (10a) and second (10b) segments is caused, thus enabling release of the first and second structures from one another.


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    Titel :

    NON-EXPLOSIVE RELEASE MECHANISM BASED ON ELECTROMAGNETIC INDUCTION MELTING


    Weitere Titelangaben:

    NICHTEXPLOSIVER AUSLÖSEMECHANISMUS AUF DER BASIS VON ELEKTROMAGNETISCHEM INDUKTIONSSCHMELZEN
    MÉCANISME DE RELÂCHEMENT NON EXPLOSIF BASÉ SUR UNE FUSION PAR INDUCTION ÉLECTROMAGNÉTIQUE


    Beteiligte:

    Erscheinungsdatum :

    2022-03-02


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B62D MOTOR VEHICLES , Motorfahrzeuge / B23K Löten , SOLDERING OR UNSOLDERING / B64G Raumfahrt , COSMONAUTICS



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