The invention refers to a separation mechanism 100 for separation of a first spacecraft component from a second spacecraft component. The separation mechanism comprises a first structural element 10 having a first connecting surface 11 and a second structural element 20 having a second connecting surface 21. Furthermore, it comprises a connecting means 30 for mechanically connecting the first and the second connecting surfaces 11, 21 and for separating them upon activation. The connecting means 30 is solder which interconnects the first and the second connecting surfaces 11, 21, wherein the soldering melts upon frictional heat occurs during entry of the first and the second structural elements 10, 20 into the earth's atmosphere.


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    Titel :

    SATELLITE COMPRISING A SEPARATION MECHANISM FOR SEPARATION OF A FIRST SATELLITE COMPONENT FROM A SECOND SATELLITE COMPONENT


    Weitere Titelangaben:

    SATELLIT MIT EINEM TRENNMECHANISMUS ZUR TRENNUNG EINER ERSTEN SATELLITENKOMPONENTE VON EINER ZWEITEN SATELLITENKOMPONENTE
    SATELLITE COMPRENANT UN MÉCANISME DE SÉPARATION PERMETTANT LA SÉPARATION D'UN PREMIER COMPOSANT DU SATELLITE D'UN DEUXIÈME COMPOSANT DU SATELLITE


    Beteiligte:

    Erscheinungsdatum :

    2021-06-23


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS / B23K Löten , SOLDERING OR UNSOLDERING



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