Provided is a semiconductor module wherein cooling capacity is improved, and an electrically-driven vehicle in which the semiconductor module is used. The semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the bottom surface of the first semiconductor element, a second heat spreader electrically and thermally connected to the bottom surface of the second semiconductor element, a DCB substrate including a first metal foil on the top surface of a ceramic insulating substrate and including a second metal foil on the bottom surface, wherein the first metal foil is electrically and thermally joined to the bottom surface of the first heat spreader and the bottom surface of the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate, wherein the first semiconductor element is disposed on the upstream side, and the second semiconductor element is disposed on the downstream side, with respect to the direction of flow of a refrigerant of the cooler, and the area of the second heat spreader is greater than the area of the first heat spreader.


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    Titel :

    SEMICONDUCTOR MODULE AND ELECTRICALLY DRIVEN VEHICLE


    Weitere Titelangaben:

    HALBLEITERMODUL UND ELEKTRISCH ANGETRIEBENES FAHRZEUG
    MODULE SEMI-CONDUCTEUR ET VÉHICULE À ENTRAÎNEMENT ÉLECTRIQUE


    Beteiligte:

    Erscheinungsdatum :

    2016-03-16


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen





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