The invention relates to a printed circuit board, electronic equipment and a vehicle. The printed circuit board comprises a multi-layer circuit substrate, a first impedance line, a second impedance line and a reference layer. The first impedance line and the second impedance line are respectively positioned on the circuit substrates of different layers and are electrically connected through via holes; the reference layer is located in a via hole avoiding area and is arranged between a layer where the first impedance line is located and a layer where the second impedance line is located, the reference layer is overlapped with the first impedance line and/or the second impedance line in the stacking direction of the circuit substrate, the reference layer is connected with a reference potential, and the reference layer is connected with the second impedance line. And the via hole avoiding area is arranged around the via hole. According to the technical scheme, the problem that the impedance line is inductively suddenly changed at the via hole position can be solved.
本公开涉及一种印刷电路板、电子设备及车辆。印刷电路板包括多层电路基板、第一阻抗线、第二阻抗线和参考层;所述第一阻抗线和所述第二阻抗线分别位于不同层的所述电路基板上,且通过过孔电连接;所述参考层位于过孔避让区,并设置于所述第一阻抗线所在层与所述第二阻抗线所在层之间,且在所述电路基板的堆叠方向上,所述参考层与所述第一阻抗线和/或所述第二阻抗线相交叠,其中,所述参考层接参考电位,所述过孔避让区围绕所述过孔设置。本公开技术方案能够解决阻抗线在过孔位置呈感性突变的问题。
Printed circuit board, electronic equipment and vehicle
印刷电路板、电子设备及车辆
30.05.2025
Patent
Elektronische Ressource
Chinesisch
Printed circuit board, electronic equipment and vehicle
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