The invention relates to a lifting mechanism and a wafer detection device. The lifting mechanism comprises a mounting base and an adjusting assembly, the adjusting assembly comprises a first adjusting piece and a second adjusting piece, the first adjusting piece is slidably connected with the mounting base in the first direction, the second adjusting piece is slidably connected with the first adjusting piece in the second direction, and the second adjusting piece is slidably connected with the first adjusting piece in the third direction. When the first adjusting part moves in the first direction, the second adjusting part moves relative to the first adjusting part in the second direction and the third direction, so that the height of the second adjusting part in the third direction is adjusted, the first direction intersects with the third direction, and the second direction is located between the first direction and the third direction. An included angle alpha between the first direction and the second direction is greater than or equal to 15 degrees and less than or equal to 30 degrees; the included angle beta between the second direction and the third direction is larger than or equal to 60 degrees and smaller than or equal to 75 degrees. The lifting mechanism has high adjusting precision on the height of the second adjusting piece in the third direction.

    本申请涉及一种升降机构及晶圆检测装置。升降机构包括:安装座以及调节组件,调节组件包括第一调节件及第二调节件,第一调节件沿第一方向可滑动连接安装座,第二调节件沿第二方向可滑动连接第一调节件,且第二调节件沿第三方向可滑动连接第一调节件,当第一调节件沿第一方向移动时,第二调节件沿第二方向及第三方向相对第一调节件移动,从而调节第二调节件在第三方向上的高度,其中,第一方向与第三方向相交,第二方向位于第一方向与第三方向之间,第一方向与第二方向之间的夹角α的范围为:15°≤α≤30°;第二方向与第三方向之间的夹角β的范围为:60°≤β≤75°。升降机构对第二调节件在第三方向上的高度具有较高的调节精度。


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    Titel :

    Lifting mechanism and wafer detection device


    Weitere Titelangaben:

    升降机构及晶圆检测装置


    Beteiligte:
    LIU SHIWEN (Autor:in)

    Erscheinungsdatum :

    21.02.2025


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    G01R Messen elektrischer Größen , MEASURING ELECTRIC VARIABLES / B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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