The invention relates to the technical field of thermal control in a space environment, in particular to a heat dissipation module and a heat dissipation system, the heat dissipation module comprises a body and a flow channel adapter tube, the body comprises a transparent packaging layer and a first reflecting layer, a micro flow channel is formed in the body, the first reflecting layer covers the inner surface of the micro flow channel, and the first reflecting layer covers the inner surface of the micro flow channel. The heat dissipation module is further provided with a contact surface, the contact surface is used for making contact with heat production equipment, the micro-channel is arranged close to the contact surface, and the end of the micro-channel is connected with the channel adapter tube. The invention aims to provide a heat dissipation module and a heat dissipation system for at least one technical problem related in the prior art.

    本申请涉及空间环境下的热控技术领域,具体而言,涉及一种散热模块及散热系统,包括本体和流道转接管,所述本体包括透明封装层和第一反射层,在所述本体内形成有微流道,所述第一反射层覆盖所述微流道的内表面,所述散热模块还具有接触面,所述接触面用于与产热设备接触,所述微流道靠近所述接触面设置,所述微流道的端部与所述流道转接管连接。本申请的目的在于针对现有技术中所涉及的至少一个技术问题,提供一种散热模块及散热系统。


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    Titel :

    Heat dissipation module and heat dissipation system


    Weitere Titelangaben:

    散热模块及散热系统


    Beteiligte:
    SUI YUANYUAN (Autor:in) / ZHANG YABIN (Autor:in) / CHANG ZHENGYONG (Autor:in) / WANG YUNING (Autor:in) / HUANG HONGZHOU (Autor:in) / MENG YINAN (Autor:in) / HE XIANGQIAN (Autor:in)

    Erscheinungsdatum :

    18.02.2025


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS



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