The embodiment of the invention provides an active mounting plate manufacturing method and an active mounting plate for spaceflight, and the manufacturing method comprises the steps: enabling an integrated circuit board to be in glue joint with a protective cover; assembling a cellular board gluing tool, and putting the cellular lower panel pasted with the glue film; the tool is filled with a honeycomb core; embedded parts, profiling mold cores and heat pipes are installed in the corresponding areas, and polystyrene foam is filled; first curing is carried out, the profiling mold core is removed after curing is completed, the integrated circuit board is installed in the honeycomb board through embedded part positioning, a short honeycomb core with the corresponding height and shape is cut, the upper side face of the integrated circuit board and the upper side face of the heat pipe are filled with the short honeycomb core, honeycomb splicing seams are filled with polystyrene foam, and the embedded part is filled with the polystyrene foam according to requirements; and carrying out secondary curing. The integrated active mounting plate reduces the number of fasteners used in assembly, reduces the number of parts involved in assembly work through the built-in integrated circuit, optimizes the assembly process, and avoids possible damage to the integrated circuit in the assembly process at the same time.

    本说明书实施例提供一种有源安装板制造方法及航天用有源安装板,制造方法,包括:将集成电路板与保护盖胶接;装配蜂窝板胶接工装,并放入贴好胶膜的蜂窝下面板;在工装中填入蜂窝芯;在相应区域安装埋件、仿形模芯以及热管,并填充发泡胶;进行第一次固化,固化完成后拆除仿形模芯,通过埋件定位将集成电路板安装至蜂窝板中,裁剪相应高度、形状的矮蜂窝芯,填入集成电路板和热管的上侧面,在蜂窝拼缝处填入发泡胶,按要求为埋件填入发泡胶;进行第二次固化。一体成型的有源安装板减少了装配在中使用的紧固件数量,通过内置集成电路,减少了装配工作中涉及的零件数量,优化了装配工序,同时避免了装配过程中可能对集成电路造成的损伤。


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    Titel :

    Active mounting plate manufacturing method and aerospace active mounting plate


    Weitere Titelangaben:

    一种有源安装板制造方法及航天用有源安装板


    Beteiligte:
    ZHAI DONGKUN (Autor:in) / ZHANG CHUANXIN (Autor:in) / BIAN YONGGANG (Autor:in) / SHEN WENKE (Autor:in) / DING WENJIAN (Autor:in) / JIANG HAO (Autor:in)

    Erscheinungsdatum :

    03.12.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    B64G Raumfahrt , COSMONAUTICS / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES , Index-Schema für besondere Gegenstände in Verbindung mit Unterklasse B29C



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