Embodiments of systems and methods for cooling systems are disclosed herein. For example, a cooling system includes a chassis defining a cavity. The circuit board assembly is disposed in the cavity and includes electronics that generate heat during operation. A heat sink is coupled to the electronic device and configured to engage the interior surface of the chassis. The fan is configured to direct air through the heat sink. An external cooling subsystem is disposed on at least one outer surface of the chassis. And the external cooling subsystem exchanges heat with the circuit board assembly through the radiator and is used for transferring heat generated by the electronic equipment.
本文公开了用于冷却系统的系统和方法的实施例。例如,冷却系统包括限定空腔的底盘。电路板组件设置在空腔中,并且包括在运行期间产生热量的电子设备。散热器耦合到电子设备并配置为接合底盘的内表面。风扇配置为引导空气穿过散热器。外部冷却子系统设置在底盘的至少一个外表面。外部冷却子系统通过散热器与电路板组件热交换,用于传递电子设备产生的热量。
Electronic control module cooling system
电子控制模块冷却系统
30.04.2024
Patent
Elektronische Ressource
Chinesisch