The invention relates to a semiconductor cooling and heating box and an automobile backseat central armrest with the same. The technical problem that an existing automobile backseat central armrest is not high in utilization rate is solved. Comprising a box body with an inner cavity and a thermoelectric semiconductor assembly arranged on the outer side of the box body, an opening is formed in the upper end of the box body, a box cover assembly capable of sealing the opening is movably arranged at the upper end of the box body, the box body is installed in a box cover, and a box body heat preservation layer wrapping the box body is arranged between the box cover and the box body. An installation space is arranged between one side of the box body along the length direction and the box cover. The thermoelectric semiconductor assembly is provided with a cold conduction block contacted with the bottom of the box body, and the cold conduction block is connected with a thermoelectric semiconductor module in the installation space. The vehicle-mounted cold and warm box has the advantages that the thickness of the vehicle-mounted cold and warm box can be reduced through the thermoelectric semiconductor assembly and the heat dissipation fin sub-assembly, the vehicle-mounted cold and warm box is integrated in the rear-row armrest assembly, and the user experience is improved. The heat conduction effect can be improved through the interface heat conduction material layer, and the refrigerating or heating effect is guaranteed.
本发明涉及一种半导体冷暖箱及具备该冷暖箱的汽车后座中央扶手。它解决了现有汽车后座中央扶手利用率不高等技术问题。包括具有内腔的箱体以及设置在箱体外侧的热电半导体总成,箱体上端敞口且在箱体上端活动设有能将敞口封闭的箱盖总成,箱体安装在箱罩内且箱罩和箱体之间设有包裹于箱体的箱体保温层,箱体沿长度方向的一侧和箱罩之间具有安装空间,热电半导体总成具有与箱体底部接触的导冷块且导冷块与位于安装空间内的热电半导体模块相连。优点在于:通过热电半导体总成和散热鳍片分总成能够减少车载冷暖箱的厚度,使车载冷暖箱集成在后排扶手总成内,提高用户使用体验。通过界面导热材料层能够提高导热效果,保证制冷或者制热效果。
Semiconductor cooling and heating box and automobile backseat central armrest with same
一种半导体冷暖箱及具备该冷暖箱的汽车后座中央扶手
2024-04-02
Patent
Elektronische Ressource
Chinesisch
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