A vehicle power module includes: an upper substrate and a lower substrate spaced apart from each other in a vertical direction; a semiconductor chip connected to one of the upper substrate and the lower substrate; and a spacer formed of a metal material including copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or connecting the upper substrate to the lower substrate, the spacer including a plurality of penetrating portions formed to penetrate through an interior of the spacer.
一种车辆电力模块,包括:上基板和下基板,在垂直方向上彼此间隔开;半导体芯片,连接至上基板和下基板中的一个;以及间隔件,由包含铜的金属材料形成并且将半导体芯片连接至上基板和下基板中的另一个或者将上基板连接至下基板,间隔件包括形成为穿透间隔件内部的多个穿透部。
Vehicle power module
车辆电力模块
2024-03-01
Patent
Elektronische Ressource
Chinesisch
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |