The invention provides a semiconductor device and a vehicle. The present invention suppresses the generation of metal powder and improves the positioning accuracy between a housing and a cooler. A semiconductor device (1) is provided with a resin part (3) covering the periphery of a semiconductor element (6), and a cooler (10) disposed below the semiconductor element. The cooler has a top plate (11) attached to the lower surface of the resin part. The resin portion has a protruding portion (39) protruding downward from the lower surface of the outer peripheral edge. The protrusion includes: a first linear portion (39a) extending in a predetermined direction in plan view; and a first curved section (39c) that is continuous with the first linear section and that is curved so as to protrude in a direction away from the first linear section. The top plate has a cutout (15) capable of engaging with the protrusion. The resin part and the top plate are joined via an adhesive (B).

    本发明提供半导体装置和车辆。抑制金属粉末的产生,并且提高壳体和冷却器之间的定位精度。半导体装置(1)具备覆盖半导体元件(6)的周围的树脂部(3)和配置于半导体元件的下方的冷却器(10)。冷却器具有安装于树脂部的下表面的顶板(11)。树脂部具有自外周缘的下表面朝向下方突出的突起部(39)。突起部包括:第1直线部(39a),其在俯视时沿规定方向延伸;以及第1弯曲部(39c),其与第1直线部相连,以朝向远离第1直线部的方向凸出的方式弯曲。顶板具有能够与突起部卡合的缺口(15)。树脂部和顶板经由粘接剂(B)接合。


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    Titel :

    Semiconductor device and vehicle


    Weitere Titelangaben:

    半导体装置和车辆


    Beteiligte:
    YOSHIDA TAIKI (Autor:in) / HIGASHI NOBUHIRO (Autor:in) / NAKAMURA TSUBASA (Autor:in)

    Erscheinungsdatum :

    2023-07-11


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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