The application discloses a hoisting assembly and a hoisting device. The hoisting assembly is used for hoisting semiconductor technology equipment. The hoisting assembly comprises a mounting sleeve, arotating shaft which axially penetrates through the mounting sleeve, and a suspended arm, wherein the middle part of the rotating shaft is located in the mounting sleeve; two ends of the rotating shaft are located outside the mounting sleeve; the rotating shaft can rotate relative to the mounting sleeve and move in the axial direction; the suspended arm comprises two separated connecting legs; the first end of the rotating shaft is detachably connected to a first connecting leg of the suspended arm through a connecting piece; a take-in hole is formed in a second connecting leg of the suspended arm; the second end of the rotating shaft can be inserted in or moved out from the take-in hole in the axial direction; compared with a hoisting tool in the prior art, the size and the weight of thesuspended arm are notably reduced, and the suspended arm disclosed by the invention can be assembled and disassembly with the rotating shaft easily, so that the hoisting of the semiconductor technology equipment is convenient.
本申请公开了一种吊装组件和吊装装置。该吊装组件用于吊装半导体工艺设备,包括安装套筒,轴向穿过所述安装套筒的转轴,所述转轴的中部处于所述安装套筒的内部,所述转轴的两端均处于所述安装套筒的外部,并且所述转轴能相对于所述安装套筒转动和沿所述轴向移动,以及吊臂,包括两个间隔开的连接腿,所述转轴的第一端通过一连接件拆装式连接至所述吊臂的第一连接腿,所述吊臂的第二连接腿上开设有收纳孔,所述转轴的第二端能沿所述轴向插入或移出所述收纳孔。由于吊臂的体积和重量比现有技术的吊装工具显著减小,而且能够容易地与转轴拆装,从而方便了半导体工艺设备的吊装。
Hoisting assembly and hoisting device
吊装组件和吊装装置
2020-09-29
Patent
Elektronische Ressource
Chinesisch
IPC: | B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last |
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