The invention discloses a hydraulic elevating high-altitude grounding device comprising a grounding clamp mechanism and an elevating device; the grounding clamp mechanism comprises a pedestal; the top of the pedestal is provided with a wiring pile head and a clamp arm; the wiring pile head is connected with a ground wire; the clamp arm is sleeved by a mobile chuck; the mobile chuck moves upwards and downwards to realize a clamp motion and a release motion; a thread hole is arranged in the pedestal; a rotary shaft penetrates the thread hole, and is screwed with the thread hole; the top of the rotary shaft is fixedly connected with the mobile chuck; the bottom of the rotary shaft is fixedly connected with a clamp board; the elevating device comprises a pedestal, a high pressure oil interface, a four-paw clamp, a rotary shaft, a high definition camera, a multi-node lifting rod, and a tripod; the hydraulic elevating high-altitude grounding device allows repair people to fast ground, is simple in structure, and grounding clamp and release motions are simple and reliable, and grounding operation is high in efficiency.


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    Titel :

    Hydraulic elevating high-altitude grounding device


    Beteiligte:
    WANG YIYONG (Autor:in) / WANG XIAODONG (Autor:in) / ZHANG ZHAOYUAN (Autor:in)

    Erscheinungsdatum :

    2015-12-23


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS / B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last



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