Due to their outstanding thermal stability, polyimides are now being carefully considered for use as matrix resins, adhesives, films and coatings. If successful, this unique class of polymers could greatly extend the present upper limit of 177°–205°C achievable in aerospace work with even higher temperatures and longer service life.


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    Titel :

    Development of Polyimides


    Beteiligte:


    Erscheinungsdatum :

    01.09.1981


    Format / Umfang :

    2 pages




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Development of polyimides

    Clair, A.K. | Tema Archiv | 1981


    Development of High Performance Piezoelectric Polyimides

    Simpson, Joycelyn O. / St.Clair, Terry L. / Welch, Sharon S. | NTRS | 1996


    Low-Dielectric Polyimides

    St. Clair, Anne K. / St. Clair, Terry L. / Winfree, William P. et al. | NTRS | 1989


    Rigid-Rod Polyimides

    Chuang, Kathy C. / Kinder, James D. / Hull, Diana L. et al. | NTRS | 1996


    Elastomer-Modified Polyimides

    Fohlen, G. M. / Parker, J. / Varma, I. K. | NTRS | 1984