The effects of the silica surface treated by coupling agents KH550, KH560 and KH570 on the rheological properties of bismaleimide (BMI) resin system were investigated. The rigidity, coefficient of thermal expansion (CTE) and thermal stability of the copper clad laminate (CCL) were studied by DMA, TMA and TGA. The resin system containing silica surface treated by KH-560, comparing to KH550, KH570 and without surface treatment resin system has better rheological properties and low melt viscosity. The comprehensive properties of the copper clad laminate can be effectively improved by the introduction of silica in the resin system, exhibiting higher storage modulus and lower CTE compare to no silica in the CCL. When the silica mass fraction is 50%, the storage modulus is increased by 83% at 50℃, and the CTE below the glass transition temperature is decreased by 153%.
Rheology of Prepreg and Properties of Silica/bismaleimide Matrix Copper Clad Laminate
2017
Aufsatz (Zeitschrift)
Elektronische Ressource
Unbekannt
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