A number of bold initiatives in advanced electronics packaging and processing are providing new ways to build the electronics functions of spacecraft, such as computers and communications functions, over 90% smaller and lighter than present systems. Such technologies will uniquely make possible the vision of “system on a chip,” “spacecraft on a chip,” and “plug-and-play spacecraft.” The initiatives are broken down along the lines of: improved density, lower cost, improved robustness, and smart interfaces. The improved density initiatives include the Highly Integrated Packaging and Processing (HIPP) and Ultra-High Density Interconnect (UHDI) programs. Initiatives to lower cost are also underway at AFRL. The investigation of plastic substrates, developed for space use in the high density interconnect (HDI) process in AFRL programs, has resulted in a technology 50% lower in weight and potentially one-fifth the cost of the previous technology.


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    Titel :

    Recent progress in cutting edge packaging technology at AFRL


    Beteiligte:
    Lyke, James C. (Autor:in) / Bragg, Mary J. (Herausgeber:in) / El-Genk, Mohamed S. (Herausgeber:in)

    Kongress:

    Space technology and applications international forum -1999 ; 1999 ; Albuquerque, New Mexico (USA)


    Erschienen in:

    AIP Conference Proceedings ; 458 , 1 ; 709-714


    Erscheinungsdatum :

    22.01.1999


    Format / Umfang :

    6 pages





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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