The purpose of this paper is to describe a developing and potentially revolutionary technology for micromachining arrays of micro heat pipes in single crystalline semiconductor silicon in order to fabricate light weight waste‐heat radiator panels. This approach results in excellent thermal conductivity to weight ratios using silicon as a base material. Micro heat pipes have been built using water as the working fluid, for low temperature (50 °C–70 °C) applications. However, for high temperature radiator panels, liquid metals will be used as the working fluid. Fabrication techniques for building liquid‐metal micro heat pipes are extensions of the general procedures used for water micro heat pipes. Additional requirements include the lining of the heat pipes with a non‐reactive material. The modifications of the general procedure ad the difficulties involved in building liquid‐metal micro heat pipes are addressed in this paper.


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    Titel :

    Liquid‐metal micro heat pipes incorporated in waste‐heat radiator panels


    Beteiligte:
    Ramadas, Padmaja (Autor:in) / Henderson, H. Thurman (Autor:in) / Badran, Bassam (Autor:in) / Gerner, Frank. M. (Autor:in) / El-Genk, Mohamed S. (Herausgeber:in) / Hoover, Mark D. (Herausgeber:in)

    Kongress:

    Proceedings of the tenth symposium on space nuclear power and propulsion ; 1993 ; Albuquerque, New Mexico (USA)


    Erschienen in:

    AIP Conference Proceedings ; 271 , 1 ; 551-557


    Erscheinungsdatum :

    10.01.1993


    Format / Umfang :

    7 pages





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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