Design and Testing of a Kinematic Package Supporting a 32 x 32 Array of GaAs MQW Modulators Flip-Chip Bonded to a CMOS Chip
JOURNAL OF LIGHTWAVE TECHNOLOGY ; 19 ; 1543-1559
2001-01-01
17 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 621.3692 |
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