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    Titel :

    Heatshield Qualification for the SpaceMail Re-Entry Capsule ``Fotino'' in the VKI Plasmatron



    Kongress:

    AIAA Atmospheric Flight Mechanics Conference ; 2008 ; Honolulu, HI



    Erscheinungsdatum :

    01.01.2008


    Format / Umfang :

    23 pages


    Anmerkungen:

    Includes bibliographical references and index



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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