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    Titel :

    A Comparison of CMOS Chip to Chip Interconnections: Vertical Optical Through-Si Links Versus High Density Electrical Interconnect



    Kongress:

    Annual meeting; 11th, IEEE: Lasers and Electro-Optics Society; LEOS '98 ; 1998 ; Orlando; FL



    Erscheinungsdatum :

    1998-01-01


    Format / Umfang :

    2 pages


    Anmerkungen:

    IEEE cat no: 98CH36243




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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