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    Titel :

    Multiwavelength DFB-LD array module using self-aligned solder bump bonding


    Beteiligte:

    Kongress:

    International conference; 11th, Integrated optics and optical fibre communications: IOOC-ECOC97 ; 1997 ; Edinburgh



    Erscheinungsdatum :

    1997-01-01


    Format / Umfang :

    4 pages


    Anmerkungen:

    Held in conjunction with the 23rd European conference on optical communications




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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