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    Titel :

    Thermal Wave Inspection of Adhesive Disbonding


    Beteiligte:

    Kongress:

    International symposium; 41st, Society for the Advancement of Material and Process Engineering ; 1996 ; Anaheim; CA



    Erscheinungsdatum :

    1996-01-01


    Format / Umfang :

    4 pages


    Anmerkungen:

    Book 1 of 2 books rec'd only. Theme title: Materials and process challenges: aging systems, affordability and alternative applications




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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