Thermal Wave Inspection of Adhesive Disbonding
International symposium; 41st, Society for the Advancement of Material and Process Engineering ; 1996 ; Anaheim; CA
1996-01-01
4 pages
Book 1 of 2 books rec'd only. Theme title: Materials and process challenges: aging systems, affordability and alternative applications
Aufsatz (Konferenz)
Englisch
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