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    Titel :

    3D Structure Assembly Analysis with a Modular Approach suited to Parallel Computations


    Beteiligte:
    Champaney, L. (Autor:in) / Cognard, J. Y. (Autor:in) / Dureisseix, D. (Autor:in) / Ladeveze, P. (Autor:in)

    Kongress:

    28th International symposium, Mechatronics - efficient computer support for engineering, manufacturing, testing & reliability ; 1995 ; Stuttgart; Germany



    Erscheinungsdatum :

    1995-01-01


    Format / Umfang :

    8 pages


    Anmerkungen:

    6; vols; Also known as 28th ISATA



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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