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    Titel :

    Capabilities of normal metal electrical interconnections for 3D MCM electronic packaging (Invited Paper) [2153-19]



    Kongress:

    Conference, Optoelectronic interconnects II ; 1994 ; Los Angeles; CA



    Erscheinungsdatum :

    1994-01-01


    Format / Umfang :

    14 pages




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Optical interconnects: topology and protocol issues (Invited Paper) [2153-35]

    Glista, A. S. / SPIE | British Library Conference Proceedings | 1994


    Self-alignment by flip-chip bonding for OE-MCM packaging (Invited Paper) [2153-18]

    Patra, S. K. / Ma, J. / Ozguz, V. H. et al. | British Library Conference Proceedings | 1994


    Digital optical interconnects for photonic computing (Invited Paper) [2153-06]

    Guilfoyle, P. S. / Stone, R. V. / Zeise, F. F. et al. | British Library Conference Proceedings | 1994


    InP-based components for wavelength division multiplexing (Invited Paper) [2153-30]

    Young, M. G. / SPIE | British Library Conference Proceedings | 1994


    Nr. 2153

    DataCite | 1886