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    Titel :

    Optically interconnected multichip module based on computer-generated holograms and flip-chip technology (Invited Paper) [2153-07]


    Beteiligte:

    Kongress:

    Conference, Optoelectronic interconnects II ; 1994 ; Los Angeles; CA



    Erscheinungsdatum :

    1994-01-01


    Format / Umfang :

    9 pages




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Self-alignment by flip-chip bonding for OE-MCM packaging (Invited Paper) [2153-18]

    Patra, S. K. / Ma, J. / Ozguz, V. H. et al. | British Library Conference Proceedings | 1994


    Prototype Optically Interconnected Multichip Module with Holographic Optical Interconnects

    IEEE; Lasers and Electro-Optics Society / IEEE; Components, Hybrids and Manufacturing Technology Society | British Library Conference Proceedings | 1993



    Optoelectronics Technology Consortium (OETC): progress and plan (Invited Paper) [2153-02]

    Lewis, D. K. / Anthony, P. J. / Hibbs-Brenner, M. K. et al. | British Library Conference Proceedings | 1994


    InP-based components for wavelength division multiplexing (Invited Paper) [2153-30]

    Young, M. G. / SPIE | British Library Conference Proceedings | 1994