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    Titel :

    Alignment Considerations in the Package Design of Optical Interconnections



    Kongress:

    Summer topical meeting, Hybrid optoelectronic integration and packaging ; 1993 ; Santa Barbara; CA



    Erscheinungsdatum :

    1993-01-01


    Format / Umfang :

    2 pages


    Anmerkungen:

    Shelved at "Leos 1993 Summer topical meeting digest on optical microwave interactions" IEEE cat no 93TH0549-6



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





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