Liquid Flux Assisted Bump Bonding Process and Thermal Design for Laser Arrays for Optical Interconnection
Summer topical meeting, Hybrid optoelectronic integration and packaging ; 1993 ; Santa Barbara; CA
1993-01-01
4 pages
Shelved at "Leos 1993 Summer topical meeting digest on optical microwave interactions" IEEE cat no 93TH0549-6
Aufsatz (Konferenz)
Englisch
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