1–20 von 179 Ergebnissen
|

    Economic Sensitivity for End of Life Planning and Processing of Personal Computers

    Boon, J.E. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility

    Mak, R.W.T. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines

    Sawik, T. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly

    Li, Y.A. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation

    Pfund, M. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Neural Network Open Loop Control System for Wave Soldering

    Coit, D.W. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Optimization of PCB Component Placement Using Genetic Algorithms

    Jeevan, K. | Online Contents | 2002
    Verlag: World Scientific , Singapore

    Design Considerations of High Heat Flux Heat Pipe Evaporators

    Zuo, Z.J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage

    Giachetti, R. E. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

    Lu, D. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Printed Circuit Board Manufacturing and Testing of RIMM[TM]

    Lau, J. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Electronic Products at their End-of-Life: Options and Obstacles

    Linton, J. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Framework for the Flexible Grouping of Products for Disassembly

    Viswanathan, S. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique

    Bhavnani, S.H. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analytical Forced Convection Modeling of Plate Fin Heat Sinks

    Teeristra, P. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements

    Takyi, G. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects

    Ng, E.Y.K. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding

    Zhong, Z. | Online Contents | 2000
    Verlag: World Scientific , Singapore

    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore