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Kraftfahrzeugelektronik
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keywords:("Kraftfahrzeugelektronik")
3D integration of image sensor SiP using TSV silicon interposer
Alternative solders for flip chip applications in the automotive environment
Flip chip technology for multi chip modules
High temperature potential of flip chip assemblies for automotive applications
Integration of micro-mechatronics in automotive applications
Micro-mechatronics in automotive applications
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Microsystems packaging for automotive applications