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packaging
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title: Optoelectronic interconnects and packaging IV
Optoelectronic interconnects and packaging IV : 12 - 14 February 1997, San Jose, California
Thermal management of free space optical interconnects [3005-06]
Optoelectronic backplane interconnect technology development: POINT (Invited Paper) [3005-03]
Recent progress in short-distance optical interconnects (Invited Paper) [3005-15]
Equal fan-out optical interconnects using DuPont photopolymer films [3005-31]
Shrinkage correction of volume phase holograms for optical interconnects [3005-48]
Optoelectronic design of the simultaneous optical multiprocessor exchange bus (SOME-Bus) [3005-42]
Alignment-tolerant lasers and silicon waferboard integration (Invited Paper) [3005-07]
Solid state polymerization reactions for passive and active guided-wave components [3005-25]
Low-power multichip module and board-level links for data transfer (Invited Paper) [3005-14]
850-nm proton-implanted 8 x 8 VCSEL array design and performance measurements [3005-43]
High-speed CMOS laser drivers [3005-44]