1–6 von 6 Ergebnissen
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    Reducing electro-magnetic radiations with a multi chip module

    Marot, C. / Dall'Agnese, P. | Tema Archiv | 1998

    Soldered flip chip IC's in automotive applications

    Thor, V. / Appel, K. / Nover, M. et al. | Tema Archiv | 1998

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archiv | 1998

    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archiv | 1998