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packaging
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keywords:(hybrid optoelectronic packaging)
A Three-Dimensional Optical Interconnection Network for Fine-Grain Parallel Architectures
Direction of Optoelectronics Research at ARPA
Simulation Tools for Free-Space Optical Interconnects Based on Computer-Generated Holograms
Rapid Prototyping of Photonic Integrated Circuits
Optoelectronic Integration of Thin Film Devices for Photonic Interconnect
CAD of Solder Joints for Self-Aligned Assemblies
Hybrid Integration of AlGaAs/GaAs Laser Diode on Si Substrate
Waveguide and Diffractive Coupling Elements for Optoelectronic Packaging
Hybrid Integration of Electrical and Optical Interconnect for MCMs Applications
Expectations from Optoelectronic Technologies
Integrated Optical Heads for Optical Data Storage
Direct Dispensing of Polymer Waveguides on Silicon Substrates
Dispensed Dual-Polymer Waveguides on Silicon V-Grooves
Optical and Package Design Issues for Chip-to-Chip Free-Space Optical Interconnections
Fabrication Issues for Free-Space Optics at the Board Packaging Level
Consortium for Optical and Optoelectronic Technologies for Computing