Optimization of PCB Component Placement Using Genetic Algorithms
Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly
The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation
Economic Sensitivity for End of Life Planning and Processing of Personal Computers
Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility
Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines
Neural Network Open Loop Control System for Wave Soldering
Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique
Analytical Forced Convection Modeling of Plate Fin Heat Sinks
Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements
Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems
Printed Circuit Board Manufacturing and Testing of RIMM[TM]
Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding
Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage
Design Considerations of High Heat Flux Heat Pipe Evaporators
Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects
Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment
The "Green Design Advisor": A Tool for Design for Environment
Product End-of-Life Strategy Categorization Design Tool
A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux
Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing
Solder Paste Tests for the 'AART' Process
The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)
Solder Paste Deposition Through High Speed Stencil Printing for a Contract Assembly Environment
An Integrated Methodology for Surface Mount PCB Configuration
Failure Mechanisms in Semiconductor Devices : E. Ajith Amerasekera and Farid N. Najm (Book review)
Analysis of Design Efficiency for the Disassembly of Modular Electronic Products
Electronic Products at their End-of-Life: Options and Obstacles
A Framework for the Flexible Grouping of Products for Disassembly
An Experimental Study of the Self Centering of BGA Packages
Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets
Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry
Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
Finite Element Modeling of Heat Transfer in Chip on Tape Packages
Modeling of Acid Copper Electroplating : A Review
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface