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    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997

    Packaging Trends seen by ITRS

    Wolf, J. / Adams, J. / Reichl, H. et al. | British Library Conference Proceedings | 2004

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archiv | 1997

    Microsystems Packaging for Automotive Applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | British Library Conference Proceedings | 2002

    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archiv | 2002

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archiv | 2001

    Alternative solders for flip chip applications in the automotive environment

    Jung, E. / Heinricht, K. / Kloeser, J. et al. | Tema Archiv | 1998

    Integration of micro-mechatronics in automotive applications

    Ansorge, F. / Becker, K.F. / Michel, B. et al. | Tema Archiv | 2001

    Analysis of Tensile Preloaded Composites Subjected to Low-velocity Impact Loads

    Kelkar, A. / Sankar, J. / Rajeev, K. et al. | British Library Conference Proceedings | 1998

    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archiv | 2005