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publisher:("World Scientific")

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Conference Report on the 1995 Japan International Electronic Manufacturing Technology Symposium

    Mannan, S. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part I : Dense suspension theory

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore